New energy photovoltaic silicon wafers are processed from silicon material made of a piece of wafer as bright as a mirror, is the production of raw materials for the semiconductor integrated circuit chips. Currently the rapid development of the microelectronics industry, integrated circuit technology has entered the era of 0.18 microns or less, which greatly stimulated the development of new energy photovoltaic silicon wafer, while the requirements of new energy photovoltaic silicon wafer performance parameters have greatly improved, so prospects for the development of new energy photovoltaic silicon wafer is very optimistic.

New energy photovoltaic silicon wafer production process, from the big side, new energy photovoltaic silicon wafer production, including the production of monocrystalline silicon rods of silicon wafers and photovoltaic energy production of two new parts, broken down into the following main processes:

Ingot Growth - Ingot cutting and inspection - outside diameter grinding - Slice - chamfered (rounded edges) - grinding / polishing film examination - etching (chemical etching, LP-CVD + AP-CVD process, etc.)-PTA Heat treatment - back injury treatment - polishing (ML rough polishing, ML fine polishing) - Wash - Quality inspection - clean packaging
Stick to the outer diameter of the single crystal growth from the grinding process for the production of monocrystalline silicon rods, after slicing process for the new energy photovoltaic silicon wafer production process.